Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
Date: 14 October 2026 | Posted by: BeMyLove
Materials for Advanced Semiconductor Packaging and Heterogeneous Integration | 137.08 MB
Title: Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
Author: Shangguan, Dongkai
Category: Electronics, Material Science, Technology, Electricity, Semiconductors, Microelectronics
Language: English | 484 Pages | ISBN: 9781040658277
Description:
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.
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